The iNEMI (Industrial Nanotechnology for Electronic Manufacturing Initiative) technology
roadmap is a collaborative effort between leading experts in various fields. It represents many
perspectives on the electronics manufacturing supply chain. The roadmap includes
contributions from over 500 individuals representing more than 350 corporations and
government agencies. The entire roadmap costs $3500 and can be purchased individually.
Special discounts are available for government agencies, universities, research laboratories,
and nonprofits. This article explores the iNEMI technology roadmap and what it means for the
iNEMI Smart Manufacturing TWG
The iNEMI Smart Manufacturing Technology Roadmap highlights key technologies to help
manufacturers realize a variety of smart manufacturing benefits. By 2022, these solutions will
generate tens of billions of dollars in gains. In the meantime, R&D programs are developing
new technologies to enable real-time analytics, improve traceability, and create flexible
modular manufacturing equipment platforms. As the supply chain continues to evolve,
interconnected technologies will become more important than ever. The roadmap also
highlights the integration of elements across manufacturing facilities and operations, including
security and PCBA production.
The roadmap provides detailed forecasts for five to seven product sectors, based on input
from industry-leading OEMs. Each chapter forecasts the evolution of key technologies that
represent the electronics manufacturing supply chain. The roadmap then compares these
forecasts to the needs of OEMs and pinpoints gaps that will need to be addressed by these
technologies. Ultimately, the roadmap is intended to aid manufacturers in making the smart
manufacturing choices that will improve their bottom-line.
Industry 4.0 is a critical enabling technology for the electronics manufacturing industry. As the
industry transitions toward smart manufacturing, these technologies will help manufacturers
enhance productivity, efficiency, and safety. With more data coming from every corner of the
production process, smart manufacturing is increasingly becoming the way to go. Smart
manufacturing technologies also help companies build virtual business models, which integrate
the supply chain, manufacturing, and customer experience. Big data analytics is an integral
part of the digital manufacturing journey, and iNEMI has brought together industry thought
leaders to help manufacturers navigate these new challenges and opportunities.
The iNEMI Smart Manufacturing Technology Roadmap will be published in waves. New
chapters will be published every two to three weeks. Its members can download the Roadmap
free of charge, while non-members can purchase the full roadmap. A single person can
download the entire roadmap, but organizations are encouraged to license it for the entire
roadmap. To license the full roadmap, organizations can download the licensing agreement
here. So, what are you waiting for? Get the iNEMI Smart Manufacturing Technology Roadmap
and start improving your business.
iNEMI’s technology roadmap
The International Electronics Manufacturing Initiative (iNEMI) has published its latest
technology roadmap for 2017. This report contains 28 chapters and more than 2,300 pages
and presents a comprehensive overview of the electronics manufacturing supply chain. The
roadmap anticipates technology needs for key market sectors such as automotive, aerospace
and defense, consumer and office systems, medical and portable and wireless. The roadmap
also highlights priority areas for standards development and funding agencies. To download an
individual chapter, click on the button below.
The roadmap outlines future capabilities and product requirements. These technologies are
being used in the production of ICs, and new lithography capabilities are revolutionizing this
process. The roadmap also includes climate change and environmental factors. Collaborative
projects could address such issues as end-of-life and recycling. This document highlights the
importance of collaboration between manufacturers and researchers to create new products
that address these challenges. iNEMI’s roadmap is also intended to encourage innovation
across a broad range of industries.
iNEMI’s technology roadmap covers both PCBs and flexible materials. The technology gap for
flexible circuits is well known, but more work is needed in the areas of polymer wave-guides,
fibre-optic flex planes, and planar glass waveguides. Payne also touched on semiconductor
packaging and commented on the trend towards organic laminate-based packaging. The new
initiative on multi-directional physical flow is a natural progression.
iNEMI’s technology roadmap covers the complete electronics manufacturing supply chain.
Using an industry-led consortium, iNEMI identifies technology gaps, helps manufacturers
prioritize investments, and provides guidance to government agencies and universities in
investing in emerging technologies. If you’re interested in getting involved in the latest
research and development, you can join the iNEMI webinar next month. You’ll gain valuable
insight into the strategy behind roadmap renewal, learn how to navigate the new online
version, and discuss the roadmap’s technical scope and rollout schedule.
iNEMI’s 2019 technology roadmap
The iNEMI Roadmap is a comprehensive analysis of the emerging technologies and the gaps
that they represent across the electronics manufacturing industry. The report includes a
chapter focusing on smart manufacturing and its challenges. It maps current capabilities and
needs across the key components of the electronics manufacturing supply chain, and
prioritizes key areas for implementation readiness. It also provides detailed industry forecasts
and data, which will help industry members determine which technologies will be most
advantageous to them.
The iNEMI technology roadmap is composed of four chapters, covering the key aspects of
emerging technologies and trends in electronic manufacturing. The first chapter covers
sustainable electronics, focusing on the development of eco-design and materials, and the
second chapter addresses value recovery. The Board Assembly chapter highlights the
importance of low-cost fine-line technology, increased density of board designs, and
miniaturization. Other chapters focus on the need for automated printing and reworkable
underfills, and temperature-sensitive devices.
In the final section of the report, Vargas identifies the most critical challenges and
opportunities in the emerging circular electronics industry. In this section, he also lists
innovative actions and strategies by industry leaders. This document is intended to help
industry leaders and innovators develop innovative solutions to meet the evolving needs of
consumers and the environment. It also highlights the importance of collaboration among
members in the industry. In addition to the technological roadmap, the iNEMI workshop will be
an opportunity for the industry to share knowledge and ideas.
Aside from focusing on a variety of technologies, the iNEMI roadmap also highlights new
developments in the field of thermal management. It covers high-end systems, consumer/office
products, medical devices, and light emitting diodes. The report also identifies technology
gaps and challenges and includes R&D recommendations. There are many other new
technologies and processes being investigated. All of these will be vital to the future of
iNEMI’s 2017 technology roadmap
iNEMI’s 2017 Technology Roadmap, released on January 10 and available to the industry for
purchase in early April, details the technology requirements of the global electronics industry
for the next decade. The roadmap discusses the major business and technology challenges,
emerging technologies, and emerging markets, and identifies technology gaps for each
product segment. With more than 200 contributors representing more than 90 organizations,
the roadmap represents an important resource for the electronics manufacturing industry.
The iNEMI Roadmap identifies critical gaps in the semiconductor manufacturing industry and
potential research programs to address these gaps. It highlights key trends in three technology
areas and three chapters, as well as one member’s project. For each of these areas, the road
map also discusses the benefits of a broader range of technologies. Ultimately, iNEMI’s
roadmap will help the electronics industry meet these needs in the coming years.
The IoT and smart manufacturing chapters address key gaps in the semiconductor industry.
These gaps will ultimately result in tens of billions of dollars in gains by 2022. To address
these gaps, iNEMI has organized an initial collaborative project. The project will tackle the
challenges of back-end electronic packaging commonality, as well as the inefficiency and cost
of unique customization requirements. The project will also define key case scenarios and
determine the benefits of improving cycle time, yield, and utilization.
Power electronics are another area that needs a solution to lower thermal resistance. Silver
sintering is an emerging process that may offer additional benefits. Low-cost packaging
materials with higher thermal conductivity are also needed for power electronics. Similarly,
advanced cooling technologies such as direct liquid and air-cooling are needed in high-
performance computers. All of these technologies help electronics manufacturers to achieve
better production efficiency and lower costs.
iNEMI’s 2018 technology roadmap
The semiconductor industry’s trade association, iNEMI, released its 2017 Technology
Roadmap to its membership on January 10, 2017, and published it for industry purchase in
early April. The roadmap discusses major business issues, paradigm shifts, emerging
technologies, emerging markets, and the needs of each product sector. It covers
IoT/Wearables, automotive, consumer/office, and emerging markets. The report also outlines
the latest trends in each product category.
The roadmap also identifies gaps between product requirements and technical capabilities, as
well as possible research programs. It also discusses the iNEMI’s technology plan and the
results of one member project. It is available for download in PDF form. The report has a
detailed outline of the iNEMI technology roadmap for the coming year, which is also available
in PDF format. To access the webinar, you must register in advance.
The enterprise networking space is driven by several technology trends. First, lower cost is an
essential requirement. Second, higher data rates mean that copper circuitry cannot cope with
the speed requirements of future devices. Third, high-speed Ethernet at 40-100Gb/s and
cabled FO interconnects are important. These trends will continue to drive innovation and
adoption. The connector industry is well-positioned to meet these challenges.
Power management will be a key area of focus in 2019. Platform components will have
multiple power states and schemes for turning components off when not in use. The thermal
issues will be critical as dies become more dense. Also, more dense platform layouts will
emerge in 2019.